Cleaning after CMPOLISH is a critical step in semiconductor manufacturing that directly impacts device reliability and yield. It has high efficiency in removing polishing particles, metal ions and organic matter, etc., and avoids surface damage. There are robust cleaning fluids for copper/cobalt interconnects, acid cleaning fluids for barrier layers/tungsten, and surfactant-enhanced cleaning fluids. This product has the advantages of ultra-high purity, low particulate matter, controllable concentration and high precision, which can meet the requirements of customers' formula and high quality.